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mechatronic ring remover (mRR) & laser cutter (mLC)
The mechatronic ring remover offers precise and efficient removal of rings from wafers, ensuring a smooth and reliable process. It is equipped with advanced sensors and control systems to handle various types of rings and wafers with high accuracy.On the other hand, the mechatronic laser cutter provides precise and clean cutting of wafers, enabling customization of wafer sizes and shapes with exceptional precision. It utilizes state-of-the-art laser technology to achieve accurate cuts without causing damage to the substrate.
Key features
mechatronic ring removal unit with maximized process control
Stress-free ring removal to avoid damages to the fragile wafer
UV treatment with LED for low cost of ownership
Integrated measurement of cutting and removal performance
Integrated laser cutting module to improve productivity and performance
High performance laser system with integrated laser power control to avoid cracks and chipping in combination with high precision positioning system
Integrated cut quality control based on advanced camera based sensing solution
No damage to tape from laser cutting
Unique handling sequence including
Continuous sensing of wafers during each step of handling
Unique handshake procedures to guarantee no wafer is lost or damaged
No contamination of device area
Available in multiple sizes: 200mm and 300mm
Thickness down to 50µm
Supports wide range of tapes (transparent, non-transparent)
SECS/GEM integration
Key benefits
Decreased CAPEX from integrated solution
Reduced footprint (Taiko ring cut and ring removal in one system)
Reduced cycle time
Increased yield
Elimination of micro cracks and chipping in combination with a smooth edge surface
Significantly reduced defect levels at the edge of the wafer
Low cost of ownership from LED UV treatment and durable blade
Configuration options
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