Ring cutter 
The cutting of the support ring is a very critical step in the removal process. Performing the cut with a physical blade creates stress and causes damage to the wafer. This can lead to scallop fractures and subsequent wafer breakage due to micro cracks. For these reasons, mechatronic employs a high-end laser, equipped with an optical system, for maximized cutting accuracy in x, y, and z-positions.



   Check out our ring remover and laser cutter (mRR, mLC)