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mechatronic systemtechnik gmbh

         
 

mechatronic systemtechnik is a successful, fast-growing high-tech company headquartered in Villach, Austria. Since 2004 we have been developing specialised machines for handling thin or warped wafers in the semiconductor industry such as TAIKO, MEMS, film frame, eWLB etc.

mechatronic's fully automated handling systems are used for non-contact transport of wafers. For this, various procedures and equipment have been developed – such as the Bernoulli and also the vacuum technology – which are applied individually according to customer demands. We are the world's only company able to handle thin and ultra-thin wafers both on the chip side and on the rear of the wafer.

Thanks to our leading-edge technology – which is being increased continuously by new developments – we can provide handling solutions for thin and ultra-thin wafers that are matched precisely to our customers' needs.

 

mechatronic Packing Tool mPT 150/200 mechatronic Packing Tool mPT 150/200
Stand alone tool for packing and unpacking 150mm (6") and 200mm (8") thin and warped wafers by a dual-arm-robot using contactless end-effectors.

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mechatronic Packing Tool mPT 150/200 frames mechatronic Packing Tool mPT 150/200f
Stand alone tool for packing and unpacking 150mm (6") and 200mm (8") wafers on film frames by a robot using a customized frame end-effector.

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mechatronic Packing Tool mPT 300 mechatronic Packing Tool mPT 300
Stand alone tool for packing and unpacking 300mm (12") thin and warped wafers by a robot using a contactless end-effector.

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mechatronic Ring Remover mRR 200/300 mechatronic Ring Remover mRR 200
Stand alone tool for removal of rings from laminated 200mm (8") wafers on film frames by a dual-arm-robot using customized frame end-effectors.

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mechatronic Wafer Sorter mWS 150/200 mechatronic Wafer Sorter mWS 150/200
Stand alone tool for sorting 150mm (6") and 200mm (8") thin and warped wafers equipped with up to six cassettes in one machine.

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ThinWafer Loader TWL 150/200 mechatronic Wafer Loader mWL 150/200t
(adaption to OEM-) tool for transferring 150mm (6") and 200mm (8") thin wafers and loading them onto a customized external chuck for optical inspection.

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mechatronic Wafer Loader mWL 200 mechatronic Wafer Loader mWL 200
(adaption to OEM-) tool for transferring 200mm (8") warped or e.g. eWLB wafers and loading them onto a customized external chuck for microscope inspection.

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mechatronic Wafer Loader mWL 300 mechatronic Wafer Loader mWL 300
(adaption to OEM-) tool for transferring 300mm (12") warped or e.g. eWLB wafers and loading them onto a customized external chuck for visual inspection.

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Latest news

10.May.2012

mechatronic systemtechnik is participating at SEMICON West as co-exhibitor with Sico Technology
20.Apr.2011

(Villach, Austria) The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.
07.Apr.2011

(Villach, Austria) Carinthia-based mechatronic systemtechnik gmbh manufacturer of thin-wafer handling systems announces a new edge grip end effector capable of handling 450mm (18’’) wafers.