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Mapping systems

mechatronic systemtechnik gmbh’s proprietary end effector, pre-aligners, mapping systems, and chucks are the reason why specialty handling approaches can be addressed. We have the ability to customize all components in our systems for various requests, to enable safe and reliable handling of nearly all substrate types used in power, sensor, and MEMS device manufacturing. 

Wafer mapping
There are multiple factors contributing to the ideal position of the end effector when picking or placing the substrate. These include substrate-driven factors (e.g. bow and warpage), cassette-driven factors (e.g. tilt or deformation), and hardware-driven factors (e.g. the thickness of the end effector). With non-standard substrates, there is a very tight margin of error and this calls for very precise mapping.

Our special mechatronic systemtechnik gmbh developed modules

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