Chucks
By using a special porous ceramic, the wafer is held on its backside without contacting the wafer chipside. The vacuum holding force is evenly spread on the entire backside surface to flatten the wafer. mechatronic chucks are designed for secure placement of various wafer types (e.g. standard, (ultra-)thin/warped, eWLB, TAIKO, film-frame, MEMS). These chucks are mainly integrated in OEM-equipment (e.g. for inspection measurement, defect detection,..) under atmospheric conditions. Due to mechatronic in-house manufacturing capabilities, we are able to design and produce all interfaces according to your requirements.
The following Chucks are available:
Wafer size:
- 6"
- 8"
- 12"
- 6"/8" & 8"/12" multi size
Frame size:
- 6"
- 8"
- 12"
Key Advantages:
- Dual zone ceramic vacuum chuck enables the flattening of warped wafers
Wafer Types:
- thin/warped
- TAIKO
Product Datasheets:
Wafer size:
- 8", 12"
- 330mm
Key Advantages:
- Patented design enables flattening of warped eWLB wafers
Wafer Types:
- eWLB
Product Datasheets:
Wafer size:
- Single size 6", 8" & 12"
- Dual size 6"/8", 8"/12"
Key Advantages:
- MEMS wafer kept in position by 4 vacuum pins in the edge exclusion area
Wafer Types:
- MEMS
Product Datasheets: