Our handling philosophy
At mechatronic systemtechnik gmbh, we take pride in our principle that ‘We can handle it’. Since our inception in 1998, we have supplied the semiconductor industry with fully automated systems for non-standard substrates and non-standard handling requirements.
Our handling philosophy
Our handling philosophy
mechatronic systemtechnik gmbh is committed to maximizing safety and handling accuracy in the solutions we offer. The stringent requirements of non-standard substrate handling can only be successfully addressed by integrating multiple specialized components into a state-of-the-art system — ensuring the handshaking process is well-established and the sensors for the substrates, their positions, and their warpages function effectively.
mechatronic systemtechnik gmbh has designed an innovative process to enable a custom selection, adoption, and integration of the various specialized components into the systems we build and deliver. In tackling each non-standard handling task, our focal point is the substrate type and size, followed by the handling requirements. Having a clear understanding of these parameters allows us to recommend the best configuration for the task.
- Focal point is the substrate (type & size) to be handled.
- mechatronic systemtechnik gmbh offers speciality components for all substrate types and sizes.
- Our systems are built on a modular concept and can accommodate various combinations of components
Substrate types
For the selection of components, the main physical properties of the substrate under consideration are:
- Thickness
- Warpage
- Flexibility
Our systems are designed to handle a wide range of substrate types with their specific characteristics.
Substrate size and handling requirements
mechatronic systemtechnik gmbh offers handling solutions for a wide range of substrates sizes, including:
- Wafer 150 mm / 200 mm / 300 mm
- Film Frames 150 mm / 200 mm / 300 mm
- Panels at sizes up to 650 mm * 650 mm
Handling Requirements
- Both sides of the substrate can be handled (chip side will only be contacted at edge exclusion area)
- Substrate flipping is available
Our systems can accommodate multiple substrate types and sizes within one configuration.
This includes:
- 150mm / 200mm
- 200mm / 300mm
- Thin wafer / TAIKO wafer
Components
The variety of components and our processes to further optimize them are among the main reasons for mechatronic systemtechnik gmbh's success in the handling of non-standard substrates:
- Identification of individual components based on handling requirements
- Capability to integrate multiple different components into one system
