Kontakt

Tiroler Straße 80
9500 Villach

+43-4242-33-999-0

office@mechatronic.at

We can handle it

At mechatronic, we take pride in our principle that ‘We can handle it’. Since our inception in 1998, we have supplied the semiconductor industry with fully automated systems for non-standard substrates and non-standard handling requirements.





We can handle it

Our handling philosophy

mechatronic systemtechnik gmbh is committed to maximizing safety and handling accuracy in the solutions we offer. The stringent requirements of non-standard substrate handling can only be successfully addressed by integrating multiple specialized components into a state-of-the-art system — ensuring the handshaking process is well-established and the sensors for the substrates, their positions, and their warpages function effectively.

mechatronic systemtechnik gmbh has designed an innovative process to enable a custom selection, adoption, and integration of the various specialized components into the system we build and deliver.

Our modular system

mechatronic systemtechnik gmbh’s modular system addresses the complex handling requirements in a cost-efficient manner. Designed for maximum flexibility and handling stability, our components and main frames can be combined and configured to handle multiple substrate sizes, substrate types, and handling requirements within one system.
Our components and modules are suitable for handling and processing substrates that require minimal to no contact, on either or both sides of the substrate.

modular system

Thin wafer handling

mechatronic systemtechnik gmbh offers handling solutions of thin wafers from a thickness of 50 µm, for power semiconductors and sensor applications. These substrates vary in materials, including silicon, III/V, and transparent materials.

mechatronic systemtechnik gmbh products featuring this technology include:

thin wafer handling

Handling of TAIKO wafers

The introduction of support rings (also reffered to as TAIKO rings), which are used to stabilize the wafers during the thinning and subsequent processes, has surfaced a need for solutions to handle these wafers.

mechatronic systemtechnik gmbh's solutions include:

handling of taiko wafers

mechatronic systemtechnik gmbh

Tiroler Straße 80
9500 Villach
Austria

Contact

Phone: +43 4242 33 999-0
Fax: +43 4242 33 999-10

Email: office@mechatronic.at