We can handle it

mechatronic systemtechnik gmbh is committed to maximizing safety and handling accuracy in the solutions we offer. The stringent requirements of non-standard substrate handling can only be successfully addressed by integrating multiple specialized components into a state-of-the-art system — ensuring the handshaking process is well-established and the sensors for the substrates, their positions, and their warpages function effectively.

mechatronic systemtechnik gmbh has designed an innovative process to enable a custom selection, adoption, and integration of the various specialized components into the system we build and deliver.

mechatronic systemtechnik gmbh’s modular system addresses the complex handling requirements in a cost-efficient manner. Designed for maximum flexibility and handling stability, our components and main frames can be combined and configured to handle multiple substrate sizes, substrate types, and handling requirements within one system.
Our components and modules are suitable for handling and processing substrates that require minimal to no contact, on either or both sides of the substrate.

mechatronic systemtechnik gmbh offers handling solutions of thin wafers from a thickness of 50 µm, for power semiconductors and sensor applications. These substrates vary in materials, including silicon, III/V, and transparent materials.

mechatronic systemtechnik gmbh products featuring this technology include:

The introduction of support rings (also reffered to as TAIKO rings), which are used to stabilize the wafers during the thinning and subsequent processes, has surfaced a need for solutions to handle these wafers.

mechatronic systemtechnik gmbh's solutions include: