Pre-aligners
mechatronic systemtechnik gmbh’s proprietary end effectors, pre-aligners, mapping systems, and chucks are the reason why specialty handling approaches can be addressed. We have the ability to customize all components in our systems for various requests, to enable safe and reliable handling of nearly all substrate types used in power, sensor, and MEMS device manufacturing.
Pre-aligners
Pre-aligners
mechatronic systemtechnik gmbh systems can be equipped with either our proprietary pre-aligners or third-party pre-aligners from Isel. mechatronic’s pre-aligners are especially useful for non-standard requirements, such as glass wafers or notch alignment on wafers boned on quartz wafer. Also, mechatronic systemtechnik gmbh also offers various chucks for its pre-aligners. Options range from contact points at the technical edge only, in combination with flipping, to Bernoulli Vacuum type of wafer holding for thin wafers. All mechatronic systemtechnik gmbh pre-aligners are capable of handling two wafer sizes (6”/8” or 8”/12”).
Pre-aligner Bernoulli Vacuum (mPA BV series)
Key features:
- Wafer size: 6"/8" or 8"/12"
- Wafer types: Thin / warped, TAIKO
- Wafer is never released (hand shaking during pick up and place)
- Bernoulli effects reduces the warpage during alignment
Pre-aligner Edge Grip (mPA EG series)
Key features:
- Wafer size: 6"/8" or 8"/12"
- Wafer types: Thin / warped, TAIKO, MEMS
- Contact points only on the technical edge of the wafers
- No vacuum or nitrogen flow for sensitive MEMS structures (membranes...)