mechatronic wafer packer (mPT)
In semiconductor manufacturing the number of wafers which are shipped between Front End Fabs and Back End Fabs or OSAT Fabs is constantly increasing, which generates an increasing demand for safe packing into shipping containers such as HWS boxes, canisters and jaws. Based on the experience and the knowledge for handling critical wafers, mechatronic has developed a fully automated system for packing and upacking of wafers into these shipping boxes at maximum reliability and safety.
mechatronic wafer packer (mPT)
mechatronic systemtechnik gmbh´s fully automated packing tool (mPT) for packing and unpacking
The fully automated wafer packer (mPT) for packing and unpacking of substrates into shipping boxes or from shipping boxes represents the latest generation of wafer packers with highest level of flexibility for substrate types, substrate sizes and material types in combination with highest reliability. Consistent implementation of mechatronic´s modular design concept and a sophisticated sensor technology guarantee full compatibility with widest variety of wafer carriers (including open cassettes, FOUPs, FOSBs) and packing material (foam, interleave, ring separators). mechatronic systemtechnik gmbh´s packer mPT is designed to enable a safe and reliable packing process, in combination with host notification of cassette ID and substrate ID. Mechatronic packing chuck is the center piece of mPT providing the biggest number of available functions in the industry.
Key features
- Unique modules and components (end effectors, pre-aligners, chucks, scanners, packing tower) being able to handle multiple types of substrates and almost all kinds of packing material in one system.
- mechatronic systemtechnik gmbh´s packing chuck enables configurations with more then 15 different material types in one system without any hardware change
- Ring separators for TAIKO wafers can be handled
- Unique wafer handling sequence: Continuous monitoring/ traceability/ sensing of wafers during each step of handling, unique handshake procedures to guarantee no wafer is lost or damaged while handled
- Highest reliability and safety, reduced stress and contamination to wafers
- High throughput (app. 150 wafers/ hour)
- Safe Packing & Unpacking with detection of material (wafer vs packing material)
- Temperature, humidity and ESD levels are traced and submitted to host
- Sorting functions are available in combination with WID reading
- Full SECS/GEM integration
Key benefits
- Fully automated system for packing and unpacking of substrates into shipping boxes or from shipping boxes, no manual handling within the machine is required
- Reduced contamination, prevention from wafer breakage and fully trackability of the wafers before they leave the wafer fab
- Packing, sorting and splitting of wafers available in one system
- Maximum uptime and availability by lowest maintenance effort
- Lowest cost of ownership
Configuration options
mPT 200/300 neo
- Designed for wafers and film frames between 200mm and 300mm
- Bridge configuration possible
- mechatronic features for non-standard substrates available
- Active control of ESD levels at packing
- Integrated material recognition for unpacking
mPT 150/200
- Designed for wafers and film frames between 150mm and 200mm
- Bridge configuration possible
- mechatronic features for non-standard substrates (thin, TAIKO, etc.) available
- Packing and unpacking with ring separators
Material types
All known types of packing material are supported.
wafer jars
- wafer jar lid
- foam
- separator
- foam liner
- foam
- wafer jar
ePAD wafer protection system
- wafer canister LID
- platform
- ePAD cushion
- separator
- wafer
- separator
- wafer
- separator
- platform
- ePAD cushion
- platform
- ePAD cushion
- wafer canister base