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mechatronic ring remover (mRR) & laser cutter (mLC)
- mechatronic ring removal unit with maximized process control
- Stress-free ring removal to avoid damages to the fragile wafer
- UV treatment with LED for low cost of ownership
- Integrated measurement of cutting and removal performance
- Integrated laser cutting module to improve productivity and performance
- High performance laser system with integrated laser power control to avoid cracks and chipping in combination with high precision positioning system
- Integrated cut quality control based on advanced camera based sensing solution
- No damage to tape from laser cutting
- Unique handling sequence including
- Continuous sensing of wafers during each step of handling
- Unique handshake procedures to guarantee no wafer is lost or damaged
- No contamination of device area
- Available in multiple sizes: 200mm and 300mm
- Thickness down to 50µm
- Supports wide range of tapes (transparent, non-transparent)
- SECS/GEM integration
- Decreased CAPEX from integrated solution
- Reduced footprint (Taiko ring cut and ring removal in one system)
- Reduced cycle time
- Elimination of micro cracks and chipping in combination with a smooth edge surface
- Significantly reduced defect levels at the edge of the wafer
- Low cost of ownership from LED UV treatment and durable blade
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