mechatronic ring remover & laser cutter
mechatronic systemtechnik gmbh`s Ring Remover(mRR) & Laser Ring Cutter module (mLC) is our solution to cut and to remove a TAIKO ring, prior to the wafer dicing step. Our approach is focused on minimizing stress to the wafer and any risk of damage to the wafer and the tape. It is a fully automated solution, cutting and removing of the ring are integrated into one process step improving productivity in combination with increased performance.
mechatronic ring remover & laser cutter
Cutting and removing of TAIKO rings
Wafer with a thickness of less than 80 micron are stabilized for grinding with a ring on the outer perimeter. Before dicing it is necessary to remove the TAIKO ring. Using this method lowers the risks of thin wafer handling (breakage, edge chipping) and decreases warpage. Prior to final processing, wafers must be separated from the ring. Conventional systems are using a circular blade for the cut, that leads to micro cracks in combination of heavy force to remove the ring (stress related damages to the dies), causing significant financial loss, and quality issues with meeting the yield requirements from increased breakage rates.
mechatronic mRR & mLC is focused on minimizing stress to the wafer and any risk of damage to the wafer and the tape. It is a fully automated solution, cutting and removing of the ring are integrated into one process step improving productivity in combination with increased performance.
Key features
- mechatronic ring removal unit with maximized process control
- Stress free ring removal to avoid damages to the fragile wafer
- UV treatment with LED for low CoO
- Integrated measurement of cutting and removal performance
- Integrated laser cutting module to improve productivity and performance
- High performance laser system with integrated laser power control to avoid cracks and chipping in combination with high precision positioning system
- Integrated cut quality control based on advanced camera based sensing solution
- no damage to tape from laser cutting
- Unique handling sequence including
- continuous sensing of wafers during each step of handling,
- unique handshake procedures to guarantee no wafer is lost or damaged
- No contamination of device area
- Available in multiple sizes: Wafer Sizes: 8” and 12”
- Throughput: 40-60 wafer/hr
- Thickness down to 50µm
- Supports wide range of tapes (transparent, non transparent)
- SECS/GEM integration
Key benefits
- Decreased CAPEX from integrated solution
- Reduced footprint (Taiko ring cut and ring removal in one system)
- Reduced cycle time
- Increased Yield
- Elimination of micro cracks and chipping in combination with a smooth edge surface
- Significantly reduced defect levels at the edge of the wafer
- Low CoO from LED UV treatment and durable blade
Configuration options
laser cutting unit
- Precise work performance due to exact alignment by improved sensors
- High-end laser system - enables adjustment of the position and focus of the laser cut through SW settings
- Exhaust system in combination with air curtain - eliminates redeposition
removal unit
- Wafer centering unit, similar to mechatronic pre-aligner centers the wafer prior to the removal step
- Integrated metrology confirms the successful execution of the removal step
- UV treatment prior to ring removal to minimize mechanical stress
- Film frame face down during the ring removing process to ensure superior defectivity performance