At mechatronic systemstechnik gmbh, we take pride in our principle that ‘We can handle it’. Since our inception in 1988, we have supplied the semiconductor industry with fully automated systems for non-standard substrates and non-standard handling requirements.
mechatronic systemtechnik gmbh has two main product lines in its portfolio. The first is the Equipment Front End Module (EFEMs) for process or metrology equipment, and the other group is the Stand-alone Systems mainly used by Integrated Device Manufacturers (IDMs).
mechatronic wafer loader (mWL)
Over the last two decades, mechatronic systemtechnik gmbh has been a trusted partner to various process and metrology equipment makers, enabling them to address non-standard handling requirements for emerging technologies and non standard substrates.
EFEM´s from mechatronic systemtechnik gmbh offer highest level of performance and capabilities, while reducing wafer transfer time significantly. Our systems are designed to be versatile and modular, are capable of handling multiple wafer types and sizes in one platform and can address complex handling requirements at the highest levels of safety and reliability
We welcome challenges and committed to deliver solutions as per our customer requirement. mechatronic systemtechnik gmbh has already developed all capabilities and expertise to meet complex wafer handling requirements. We work closely with OEM customers to deliver the solution and technologies needed to enable their success.
mechatronic wafer sorter (mWS)
mechatronic systemtechnik gmbh´s mWS series represents the latest generation of wafer sorters and sets new standards in safe handling of thin, ultra-thin or warped wafers. Consistent implementation of our modular design concept guarantees full compatibility with the widest variety of wafer carriers. All sorters can be configured to be a flexible solution for multiple wafer types as they are emerging in modern semiconductor fabrication.
Potential operations of the wafer sorting system include automatic sort, split/customize split, merge, randomize and transfer from any plastic,metal, transport or process cassette..
mechatronic wafer packer (mPT)
In semiconductor manufacturing the number of wafers which are shipped between Front End Fabs and Back End Fabs or OSAT Fabs is constantly increasing, which generates an increasing demand for safe packing into shipping containers such as HWS boxes, canisters and jaws. Based on the experience and the knowledge for handling critical wafers, mechatronic has developed a fully automated system for packing and upacking of wafers into these shipping boxes at maximum reliability and safety.
mechatronic ring remover & laser cutter
The ring remover is mechatronic systemtechnik gmbh's fully automated solution to cut and to remove a TAIKO ring, prior to the wafer dicing step. Our approach is focused on minimizing stress to the wafer and any risk of damage to the wafer. To achieve this, mechatronic systemtechnik gmbh uses a laser system for the cutting of the ring and performs the removal with a unique approach where the ring is gently peeled from the tape while the substrate is flipped.
Integrated metrology equipment measures the quality of the cut and the quality of the removal step, and also provides valuable data to the factories host system.
mechatronic calotte loader (mWL calotte)
This system is designed for loading wafers from cassettes into dome-shaped substrate holders for subsequent metal deposition. Evaporation process tools often utilize spherical carriers and rings to meet uniformity and defectivity targets. However, today integrated device manufacturers (IDMs) are using manual wafer loading in this step of the manufacturing process. This is resulting in yield degradation and an increased risk for misprocessing.
A fully automated stand-alone system for transferring wafers between cassettes and calottes, the mWL calotte provides IDMs an opportunity to increase yield and improve process traceability at a high throughput.