New FOUP Loader in cooperation with Nikon launched.
New Packing tool module mPT Neo.
New service location in Penang (Malaysia).
New organisation and processes implemented.
Incorporation of mechatronic systemtechnik Asia Sdn. Bhd. In Penang, Malaysia.
E-Service Portal launched.

Further standarisation and modularisation of mechatronic tools.
Incorporation of Mechatronic Asia Pte. Ltd. in Singapore.
Set up of new service location in Dresden, Germany.
New CRM system implemented.

New wafer packing machine, wafer ring remover and Frame Remounter tools developed and launched in the market.

Large scale, worldwide rollout of thin-wafer handling machines.

20 thin-wafer handling machines are in operation with customers. The product range in the sector for thin wafer handling includes thin wafer handlers, packers and loaders as well as individual components such as scanners, pre-aligners and End Effectors.

Start of series production of thin-wafer handling systems.

Development of a world first thin-wafer handling machine and a prototype for Infineon - Start of partnership with Infineon, Villach, in the area of thin-wafer handling.

Expansion of cleanroom to more than 600 m2 of Grade 1.000 and assembly of special equipment for the semiconductor industry and the semiconductor supplier industry.

Commissioning of the cleanroom (300 m2) for production of facilities for wafer production for customers in the semiconductor industry.

mechatronic wins its first reference customers such as Infineon, SEZ, Fresenius, Elan and CCSystems.

Establishment of mechatronic systemtechnik gmbh by Walter Schober.