Thin Wafer Handling

The main business field of mechatronic systemtechnik is formed by systems and components for handling of wafers with sizes of 150, 200 or 300 millimetres and a thickness of 50 to 150 micrometres. The production of both "stand-alone tools" and the integration of systems in existing equipment is possible.

The solutions are typified by contactless handling of wafers using the Bernouilli vacuum principle so that even wafers that are under extreme internal tension can be transported.

The modular design enables both the rapid and economical retrofitting of existing systems and the conversion of equipment to thin-wafer technology. In addition to a high throughput, the focus is on compactness and reduction of operating costs.