By using a special porous ceramic, the wafer is held on its backside without contacting the wafer chipside. The vacuum holding force is evenly spread on the entire backside surface to flatten the wafer. mechatronic chucks are designed for secure placement of various wafer types (e.g. standard, (ultra-)thin/warped, eWLB, TAIKO, film-frame, MEMS). These chucks are mainly integrated in OEM-equipment (e.g. for inspection measurement, defect detection,..) under atmospheric conditions. Due to mechatronic in-house manufacturing capabilities, we are able to design and produce all interfaces according to your requirements.

The following Chucks are available: