TAIKO Wafer Ring Remover (mRR)

Ring Remover Fully Automated Ring Separation

Wafers with a thickness less than 80 micron stabilize after grinding with a ring on the outer perimeter. Before dicing it is necessary to remove the stabilization ring. Using this method lowers the risks of thin wafer handling (breakage, edge chipping) and decreases warpage.

Prior to final processing, wafers must be separated from the ring. The mechatronic Ring Removers Series mRR fully automatically removes the ring.