Facts and Figures

  • Founded in 1998

  • Headquarter, R&D and production in Villach, Austria

  • Global provider of automation equipment for complex wafer handling (thin/warped wafer, stacked wafer, eWLB, MEMS, TAIKO, film frames,...)

  • Service locations in Dresden (Germany), Penang (Malaysia)

  • Wafer thickness down to 30μm, highly sensitive, max. warpage

  • App. 650 sqm cleanroom facility

  • Service partners in Taiwan, USA, Singapore, Philippines, China, Korea

  • Strong customer base, including most of the leading semiconductor companies

  • All wafer touching and critical parts manufactured in-house

  • About 90 employees

  • More than 200 tools delivered

  • ISO 9001 & 14001 certified