Wafer Sorter mWS 150/200
The Wafer Sorter mWS 150/200 is designed for sorting, (mass) transfering, splitting or merging 150 mm and 200 mm (6”/8”) thin and warped wafers in one machine and can be equipped with up to six cassettes. The mWS 150/200 continuously monitors all wafers in the cassette before and during the whole work process and verifies the conformity of wafer and end-effector size.
The mWS 150/200 comes with two scanners (each for up to three cassettes), a dual-arm-robot, Bernoulli vacuum end-effectors and a pre-aligner. Optionally it can be equipped with other end-effectors (e.g. Top Grip or Batch), an appropriate automated end-effector change station, as well as an end-effector cleaner and a green light visual inspection module.
Features:
- Wafer sizes: 150 mm (6”) and 200 mm (8”)
- Sorting of two wafer sizes in one machine
- Handling of warped wafers
- Optimized footprint
- Automated changing and cleaning of end-effectors optional
- Green light visual inspection optional
- OCR reader for wafer ID optional
- FFU for better cleanliness class optional
- Cleanliness class 5 (ISO EN 14 644-1)
- CE certificated
- SEMI standards compliant
- UPS (uninterruptible power supply) optional
Product Videos
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20.Apr.2011
(Villach, Austria) The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.
07.Apr.2011
(Villach, Austria) Carinthia-based mechatronic systemtechnik gmbh manufacturer of thin-wafer handling systems announces a new edge grip end effector capable of handling 450mm (18’’) wafers.