Wafer Loader mWL 300
The Wafer Loader mWL 300 is designed for fully automated loading and unloading of 300 mm (12") standard wafers or e.g. eWLB wafers from FOUPs/FOSBs onto an external chuck.
The mWL 300 comes with two load ports, a single-arm-robot on a linear track and an appropriate end-effector. Optional it can be equipped with a pre-aligner, a customized external chuck and a RFID reader for FOUP / FOSB detection, as well as with a 200 mm (8") kit.
The adaptation to OEM tools according to customer requirements is possible.
Features:
- Wafer size: 300 mm (12") or optional 200 mm (8")
- Loading and unloading of a chuck
- Handling of standard- or e.g. eWLB wafers
- Handling of warped wafers
- Optimized footprint
- Standard FOUP or FOSB compliant
- 200 mm (8") kit optional
- RFID reader optional
- OCR reader for wafer ID optional
- FFU for better cleanliness class optional
- Cleanliness class 5 (ISO EN 14 644-1)
- CE certificated
- SEMI standards compliant
- UPS (uninterruptible power supply) optional
Product Images
20.Apr.2011
(Villach, Austria) The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.
07.Apr.2011
(Villach, Austria) Carinthia-based mechatronic systemtechnik gmbh manufacturer of thin-wafer handling systems announces a new edge grip end effector capable of handling 450mm (18’’) wafers.