Wafer Loader mWL 150/200t

The Wafer Loader mWL 150/200t is designed for fully automated loading and unloading of 150/200 mm (6"/8") thin-wafers from cassettes onto an external chuck for visual inspection. 

The mWL 150/200t comes with a dual-arm-robot (with flip box optional), a combination of a Bernoulli vacuum- and a top grip end-effector of the same size*, a transfer station (for storing a wafer while taking a different end-effector for further process) incl. an end-effector cleaner, as well as a touch screen. Optionally wafers and cassettes can be tracked, identified, located and reported before and during the whole work process. Therefor it can individually be equipped with two scanners, a pre-aligner, an additional end-effector combination**, a fully automated end-effector change station and a customized external chuck.

The adaptation to OEM tools according to customer requirements is possible.

Features:

• Wafer sizes: 150 mm (6") or 200 mm (8")*
• Handling of two wafer sizes in one machine optionally possible**
• Loading and unloading of a chuck
• Handling of e.g. thin-wafers > 50 µm (1,97 mil)
• Handling of warped wafers
• Chip side and back side handling
• Optimized footprint
• Flip box optional
• Automated end-effector change after wafer size change optional
• Automated end-effector cleaning after end-effector change optional
• OCR reader for wafer ID optional
• FFU for better cleanliness class optional
• Cleanliness class 5 (ISO EN 14 644-1)
• CE certificated
• SEMI standard compliant
• UPS (uninterruptible power supply) optional

Loader configurations: the following end-effector combinations are possible

• *150 mm: 1x Bernoulli vacuum 6" + 1x top grip 6" or
• *200 mm: 1x Bernoulli vacuum 8" + 1x top grip 8" or
• **mixed: 1x Bernoulli vacuum 6" + 1x top grip 6" and 1x Bernoulli vacuum 8" + 1x top grip 8"

Product Videos

Product Datasheets

mechatronic Wafer Loader 150_200-thin.pdf

Product Images