Which handling technologies does mechatronic systemtechnik support?

The handling process itself takes place with grippers, so called end-effectors, which manipulate the wafer. Here, due to the high sensitivity of the wafers, special gripping systems were developed. Depending on customer requirements, various gripper technologies are used: gripping the back of the wafer with the Bernoulli vacuum technology, gripping the chip side (front) with the Bernoulli technology in a virtually contactless procedure, gripping the back side or the chip side of the wafer with the Bernoulli technology and pins on which the actual thin wafer is supported. Other technologies are available on demand.