Which advantages are associated with mechatronic systemtechnik handling systems?

Standard wafers have a diameter of 700 µm to 1000 µm, the automated handling takes place with the use of vacuum grippers. New generations of chips are produced on so-called thin wafers with a thickness from 50 µm to 150 µm featuring the same properties as a sheet of paper. Through contact by a gripper a deformation arises, which can quickly lead to breaking, due to the brittleness of the material. This makes it necessary to handle a thin wafer with a "serving tray" on a full-scale support and not pick it at points with a gripper.

The automated handling of wafers is the basic requirement of automated production. This automated production is necessary not only for cost efficiency, but it is the prerequisite for quality assured production with a high throughput.