Ring Remover mRR 200
The Ring Remover mRR 200 enables fully automated removal of rings from laminated 200 mm (8") wafers on film frames.
The mRR 200 comes with two cassette ports for 200 mm (8”) wafers on film frames, a mapper, a dual-arm-robot, two customized frame end-effectors 8" and two ring remover stations 8", as well as a touch screen. Optionally it can be equipped with a 300 mm (12") kit.
Features:
- Film frame size: for 200 mm (8") or optional 300 mm (12") wafers
- Automated ring removing from wafers on film frames
- Optimized footprint
- Throughput of up to 70 wafers on film frames/hour (standard layout with two ring remover stations)
- 300 mm (12") kit optional
- OCR reader for wafer ID optional
- FFU for better cleanliness class optional
- Cleanliness class 6 (ISO EN 14 644-1)
- CE certificated
- SEMI standard compliant
- UPS (uninterruptible power supply) optional
Product Images
20.Apr.2011
(Villach, Austria) The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.
07.Apr.2011
(Villach, Austria) Carinthia-based mechatronic systemtechnik gmbh manufacturer of thin-wafer handling systems announces a new edge grip end effector capable of handling 450mm (18’’) wafers.