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Press Releases

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mechatronic systemtechnik gmbh presents new Wafer Handling Systems RR200/300 and FPT150/200

(Villach, Austria) Carinthia-based mechatronic systemtechnik gmbh manufacturer of thin-wafer handling systems recently came out with two newly developed stand-alone systems: Ring Remover RR200/300 and Frame Packing Tool FPT150/200.

mechatronic systemtechnik demonstrates special competence in the photovoltaic industry

(Villach, Austria) Thanks to its special knowledge in the field of thin-wafer handling, mechatronic systemtechnik, a supplier of handling equipment for the semiconductor industry based in Carinthia, Austria, has been selected by the European Commission to make its skills available to the photovoltaic industry.

mechatronic systemtechnik Certified in Accordance With ISO 14001

(Villach, Austria) At the end of June, mechatronic systemtechnik, provider of thin-wafer handling systems, was successfully certified in accordance with environment standard ISO 14001.

Latest news

24.Nov.2011


mechatronic systemtechnik will be represented by Delexon Technologies Japan Co. Ltd. at SEMICON Japan
20.Apr.2011

(Villach, Austria) The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.
07.Apr.2011

(Villach, Austria) Carinthia-based mechatronic systemtechnik gmbh manufacturer of thin-wafer handling systems announces a new edge grip end effector capable of handling 450mm (18’’) wafers.