Packing Tool mPT 300
The Packing Tool mPT 300 is designed for packing and unpacking of 300 mm (12”) wafers by using a contactless end-effector.
The mPT 300 comes with two load ports for 12" FOUPs, a single-arm-robot, a contacless end-effector, a packing tool containing e.g. four material box stations and two shipping box stations, as well as a touch screen. Optionally it can be equipped with a special customized pre-aligner. The mPT 300 offers an outstanding “throughput/footprint ratio” of up to 160 wafer/m² and is operated and loaded only at the front so that the entire service area can stand outside the cleanroom.
Features:
- Wafer size: 300 mm (12”)
- Packing and unpacking of e.g. thin-wafers
- Handling of warped wafers
- Contacless end-effector
- Optimized footprint
- High throughput
- Outstanding "throughput/footprint ratio"
- 200 mm (8") kit optional
- OCR reader for wafer ID optional
- FFU for better cleanliness class optional
- Cleanliness class 6 (ISO EN 14 644-1)
- CE certificated
- SEMI standard compliant
- UPS (untinterruptible power supply)
Product Videos
Product Images
20.Apr.2011
(Villach, Austria) The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.
07.Apr.2011
(Villach, Austria) Carinthia-based mechatronic systemtechnik gmbh manufacturer of thin-wafer handling systems announces a new edge grip end effector capable of handling 450mm (18’’) wafers.