Packing Tool mPT 150/200
The Packing Tool mPT 150/200 is designed for packing and unpacking of 150 mm and 200 mm (6”/8”) wafers by using contactless end-effectors.
The mPT 150/200 comes with a dual-arm-robot including two flip boxes, contactless end-effectors for 150 mm and 200 mm wafers, a packing tool containing e.g. three material stations and two shipping box stations as well as a touch screen. Optionally it can be equipped with scanners for 150 mm and 200 mm cassettes, a pre-aligner and a green light visual inspection module.
Features:
- Wafer sizes: 150 mm (6”) and 200 mm (8”)
- Packing and unpacking of e.g. thin-wafers
- Handling of warped wafers
- Contactless end-effectors
- Optimized footprint
- High throughput
- Cassette scanning optional
- Green light visual inspection optional
- OCR reader for wafer ID optional
- FFU for better cleanliness class optional
- Cleanliness class 6 (ISO EN 14 644-1)
- CE certificated
- SEMI standard compliant
- UPS (uninterruptible power supply) optional
Product Videos
Product Images
20.Apr.2011
(Villach, Austria) The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.
07.Apr.2011
(Villach, Austria) Carinthia-based mechatronic systemtechnik gmbh manufacturer of thin-wafer handling systems announces a new edge grip end effector capable of handling 450mm (18’’) wafers.