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History


1998:

Establishment of mechatronic systemtechnik gmbh by Walter Schober.


1999-2000:

mechatronic systemtechnik wins its first reference customers such as Infineon, SEZ, Fresenius, Elan and CCSystems.


2001:

Commissioning of the cleanroom (300 m2) for production of facilities for wafer production for customers in the semiconductor industry.


2003:

Expansion of cleanroom to more than 600 m2 of Grade 1.000 and assembly of special equipment for the semiconductor industry and the semiconductor supplier industry.


2004:

Development of a world first thin-wafer handling machine and a prototype for Infineon - Start of partnership with Infineon, Villach, in the area of thin-wafer handling.


2005/2006:

Start of series production of thin-wafer handling systems.


2007:

20 thin-wafer handling machines are in operation with customers. The product range in the sector for thin wafer handling includes thin wafer handlers, packers and loaders as well as individual components such as scanners, pre-aligners and end effectors.


2008-2010:

Large scale, worldwide rollout of thin-wafer handling machines.

Latest news

24.Nov.2011


mechatronic systemtechnik will be represented by Delexon Technologies Japan Co. Ltd. at SEMICON Japan
20.Apr.2011

(Villach, Austria) The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.
07.Apr.2011

(Villach, Austria) Carinthia-based mechatronic systemtechnik gmbh manufacturer of thin-wafer handling systems announces a new edge grip end effector capable of handling 450mm (18’’) wafers.