Special Production
The third business area of mechatronic systemtechnik is formed by mechanical engineering and plastic production both of simple workpieces and of complex system components of the widest variety of materials. The production processes extend from milling, turning and drilling to bonding and welding on state-of-the-art CNC machines with CAM interfaces. The possible production sizes extend up to 3.000 millimetres long and up to 1.220 millimetres wide. All manufactured parts are subject to strict quality checks.
20.Apr.2011
(Villach, Austria) The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.
07.Apr.2011
(Villach, Austria) Carinthia-based mechatronic systemtechnik gmbh manufacturer of thin-wafer handling systems announces a new edge grip end effector capable of handling 450mm (18’’) wafers.