Cleanroom Engineering & Assembling
A second pillar of mechatronic systemtechnik is the assembly of process machines for the semiconductor industry in a cleanroom of ISO class 4 (former class 1.000 / US FED Standard 209). The mechatronic systemtechnik assembly know-how with the focus on reduced throughput times, certified processes and high efficiency is reflected in long-term customer relationships and numerous awards.
20.Apr.2011
(Villach, Austria) The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.
07.Apr.2011
(Villach, Austria) Carinthia-based mechatronic systemtechnik gmbh manufacturer of thin-wafer handling systems announces a new edge grip end effector capable of handling 450mm (18’’) wafers.