Edge Grip End-Effectors
The edge grip end-effectors (mEG series) are designed for back side handling of MEMS wafers.
Types according to wafer size:
- 150 mm / 6” (end-effector mEG 150)
- 200 mm / 8” (end-effector mEG 200)
- 300 mm / 12” (end-effector mEG 300) - multi gripper, special design
- 450 mm / 18” (end-effector mEG 450) - special design
Function:
Edge grip end-effectors enable direct handling of wafers with two flats (primary and secondary flat). The alignment of the wafer is not important for the handling procedure. The edge grip end-effector touches the wafer only at the edge exclusion. The process area is safe.
An adapter for special applications is available, including:
- Mapping sensor
- Capacitive Sensor
- Speed regulator for clamping
- etc.
Features:
- Wafer sizes: 150 mm (6"), 200 mm (8"), 300 mm (12"), 450 mm (18")
- MEMS wafer handling
- Back side handling at the edge
- Conductive PEEK coating
- Automated quick coupling or adapter
- Automated loading and unloading of several mechatronic components
Product Images
10.May.2012
mechatronic systemtechnik is participating at SEMICON West as co-exhibitor with Sico Technology
20.Apr.2011
(Villach, Austria) The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.
07.Apr.2011
(Villach, Austria) Carinthia-based mechatronic systemtechnik gmbh manufacturer of thin-wafer handling systems announces a new edge grip end effector capable of handling 450mm (18’’) wafers.