Contactless End-Effectors
The contactless end-effectors (mCL series) are designed for contactless chip side & back side handling of thin and warped wafers, e.g. out of and into a cassette.
Types according to wafer size:
- 150 mm / 6” (end-effector mCL 150)
- 200 mm / 8” (end-effector mCL 200)
- 300 mm / 12” (end-effector mCL 300)
Function:
The contactless end-effectors use only Bernoulli airflow (no vacuum). The wafer is hovering on the air cushion 0.2 - 0.3 mm above or below the end-effector and is limited sideways by PEEK-elements.
This end-effector does not require the wafer to be fully planarized. Even warped wafers which are too stiff for other systems can be handled.
Features:
- Wafer sizes: 150 mm (6”), 200 mm (8”), 300 mm (12”)
- For thin-wafers > 50 µm (2 mil)
- Warped wafer handling (up to 12 mm warpage)
- Chip side and back side handling
- Contacless handling with Bernoulli airflow
- Wafer detection with capacitive sensing
- Automated quick coupling
- Automated loading and unloading of several mechatronic components
- Antistatic surface
Product Images
10.May.2012
mechatronic systemtechnik is participating at SEMICON West as co-exhibitor with Sico Technology
20.Apr.2011
(Villach, Austria) The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.
07.Apr.2011
(Villach, Austria) Carinthia-based mechatronic systemtechnik gmbh manufacturer of thin-wafer handling systems announces a new edge grip end effector capable of handling 450mm (18’’) wafers.