Bernoulli Vacuum End-Effectors
The Bernoulli vacuum end-effectors (mBV series) are designed for back side handling of thin and warped wafers, e.g. for handling from the cassette to the pre-aligner.
Types according to wafer size:
- 150 mm / 6” (end-effector mBV 150)
- 200 mm / 8” (end-effector mBV 200)
Function:
The Bernoulli vacuum end-effectors use Bernoulli air-flow and vacuum one after the other. For flattening the warped wafer in the cassette a short burst of clean dry air (CDA) or nitrogen is applied to bring the wafer into the right position. Via vacuum the wafer is secured on the end-effector.
Features:
- Wafer sizes: 150 mm (6”), 200 mm (8”)
- For thin-wafers > 50 µm (2 mil)
- Warped wafer handling (up to 12 mm warpage)
- Back side handling
- Bernoulli airflow and vacuum
- Automated quick coupling
- Automated loading and unloading of several mechatronic components
Product Images
10.May.2012
mechatronic systemtechnik is participating at SEMICON West as co-exhibitor with Sico Technology
20.Apr.2011
(Villach, Austria) The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their collaboration in the field of handling thin substrates by means of T-ESC®-Technology.
07.Apr.2011
(Villach, Austria) Carinthia-based mechatronic systemtechnik gmbh manufacturer of thin-wafer handling systems announces a new edge grip end effector capable of handling 450mm (18’’) wafers.